Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
We also have detailed materials explaining mold (potting) and coating that can implement measures for waterproofing, humidity resistance, and earthquake resistance of the implementation substrate.
If the printed circuit board is used as is, it often leads to malfunctioning of the board, damage to components or the board itself, and a reduction in the lifespan of the board. Therefore, for printed circuit boards in harsh environments, measures such as waterproofing, moisture-proofing, vibration-proofing, dust-proofing, and explosion-proofing become necessary. As a countermeasure, resin molding (resin potting) can be used to inject urethane resin into cases, which can shut out dust, dirt, water, and vibrations. Additionally, since the board is fixed in place, it can be protected from vibrations. *Consideration for implementation is possible even without a case. Furthermore, by coating the surface of the board, it is possible to protect the board from dust, dirt, and moisture. *For more details, please refer to the PDF document or feel free to contact us.
- Company：東條製作所
- Price：Other
